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Why Lithography ?

Device manufacturing cannot be performed with single-layer thin films. For the production of semiconductor devices such as transistors, LEDs, photodetectors, cameras, substrate (wafer) and layers must be patterned and coated or etched. 

Lithography is basically the process of transferring geometric shapes onto a substrate. In the production of modern semiconductor devices, the patterns on the maxe (digital or mechanical) are transferred to the photoresist on the substrate (wafer) with UV radiation, and the semiconductor device designed with the coating or etching stages is produced. For a complex CMOS structure, this process is done up to 50 times.  


  • Mask Aligner Photolithography Systems

  • Spin coating systems 

Mask Aligner Photolithography Systems

The Lithorium Mask Aligner is a low-cost system for use in research and development for lithography system, semiconductor and micro-device manufacturing. It brings user-friendliness and low infrastructure costs with its unique design made by considering the outputs of devices and equipment used in international platforms.

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Spin Coating Systems

Spin coating is based on the principle of forming a thin film on the surface by rotating the fluid material applied to the surface of materials such as flat surfaces and wafers at high speeds.  

Spin coater, materials  It is a widely used and versatile technique for laying thin films on a substrate or flat material surface with accurate and controllable film thicknesses.

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